Référence fabricant
219-263B
219 Series 12.7 x 25.91 mm Solderable Feet SMT TO-263 Heatsink Anodzd
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| Nom du fabricant: | Wakefield Thermal | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :200 par Box Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Wakefield Thermal 219-263B - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Statut du produit:
Wakefield Thermal 219-263B - Caractéristiques techniques
| Thermal Resistance: | 8°C/W |
| Material: | Aluminum / Black Anodized |
| Dimension: | H 11.6mm x L 12.7mm x W 35.2mm |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.
Features & Benefits:
• Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish
• Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets
• Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time
• Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks
• Available in bulk packaging or Tape & Reel
Emballages disponibles
Qté d'emballage(s) :
200 par Box
Méthode de montage :
Surface Mount