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Référence fabricant
MIC26400YJL-TR
MIC26400 Series 26 V 300 kHz 5 A SMT Synchronous DC/DC Buck Regulator - MLF-28
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| Nom du fabricant: | Microchip | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :MLF-28 Méthode de montage :Surface Mount |
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Microchip MIC26400YJL-TR - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Final NotificationDescription of Change:Qualification of AOS1 as new fabrication location for Die #2 and Die #3 for selected MIC24051, MIC24052, MIC26400, MIC26601, MIC26603, and MIC26603Z device families available in 28L VQFN (5x6x0.9mm) package.Reason for Change:To improve manufacturability by qualifying AOS1 as a new fabrication site for Die #2 and Die #3.Change Implementation Status:In ProgressEstimated First Ship Date:30 May 2025 (date code: 2522)
PCN Status:Final NotificationDescription of Change:Qualification of AOS1 as a new fabrication site for Die #2 and/or #3 on MIC26603YJL-TR, MIC26400YJL-TR, MIC26601YJL-TR, MIC27600YJL-TR, MIC24066T-E/QNA, MIC24067T-E/QNA, MIC26603-ZAYJL-TR, MIC26603-ZYJL-TR, MIC24051YJL-TR, and MIC24052YJL-TRcatalog part numbers (CPN) available in 28L and 36L VQFN (5x6x0.9mm) package.Reason for Change:To improve manufacturability by qualifying AOS1 as a new fabrication site Die #2 and/or #3.Change Implementation Status:In ProgressEstimated First Ship Date:February 03, 2025 (date code: 2506)
Description of Change:Qualification of AOS1 as new fabrication location for Die #2 and Die #3 for selected MIC24051, MIC24052, MIC26400, MIC26601, MIC26603, and MIC26603Z device families available in 28L VQFN (5x6x0.9mm) package.Reason for Change:To improve manufacturability by qualifying AOS1 as a new fabrication site for Die #2 and Die #3.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of MAPW as a new fabrication site for Die #2 of selected Micrel MIC266xx, MIC240xx, MIC264xx and SPN030xx device families available in 28L VQFN (5x6x0.9mm) package.Reason for Change:To improve productivity by qualifying MAPW as a new fabrication site for die #2.***Attached the Qualification Report. Updated notification subject and description of change to reflect MIC266xx instead of MIC66xx. Provided estimated first ship date to be on July 31, 2024.
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC26400YJL-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--switching-regulators/mic26400yjl-tr-microchip-5006270
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC26400YJL-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--switching-regulators/mic26400yjl-tr-microchip-5006270
Microchip MIC26400YJL-TR - Caractéristiques techniques
| Topology: | Buck |
| Input Voltage: | 4.5V to 26V |
| Output Current-Max: | 5A |
| Switching Frequency-Max: | 300kHz |
| Style d'emballage : | MLF-28 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC26400YJL TR is a constant-frequency, synchronous buck regulator featuring a unique digitally modified adaptive ON-time control architecture. The MIC26400 operates over an input supply range of 4.5 V to 26 V and provides a regulated output at up to 5 A of output current.
The MIC26400 offers a full suite of protection features to ensure protection of the IC during fault conditions. These include undervoltage lockout to ensure proper operation under power-sag conditions, internal soft-start to reduce inrush current, foldback current limit, “hiccup” mode short-circuit protection and thermal shutdown.
Features:
- Hyper Speed Control™ architecture enables
- High delta V operation (VIN = 26 V and VOUT = 0.8 V)
- Small output capacitance
- 4.5 V to 26 V input voltage
- Output down to 0.8 V with ± 1% accuracy
- Any Capacitor™ Stable
- Zero ESR to high-ESR output capacitance
- 5 A output current capability
- 300 kHz switching frequency
- Internal compensation
- Up to 95% efficiency
- 6 ms Internal soft-start
- Foldback current limit and "hiccup" mode short-circuit protection
- Thermal shutdown
- Supports safe start-up into a pre-biased load
- –40° C to +125° C junction temperature range
- 28-pin 5 mm X 6 mm MLF® package
Applications:
- Distributed power systems
- Communications/networking infrastructure
- Set-top box,gate ways and routers
- Printers,Scanners,graphics Cards and video cards
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
MLF-28
Méthode de montage :
Surface Mount