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Référence fabricant
SST39VF020-70-4I-NHE
SST39VF Series 2 Mbit 256 K x 8 3 V Multi-Purpose Flash - PLCC-32
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :30 par Tube Style d'emballage :PLCC-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SST39VF020-70-4I-NHE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Datasheet for the SST39LF010/SST39LF020/SST39LF040/SST39VF010/SST39VF020/SST39VF040 - 1-Mbit/2-Mbit/4-Mbit (x8) Multi-Purpose Flash of devices. Updated TSOP package marking; Minor editorial updates throughout the document.Reason for Change: To Improve ProductivityDate Document Changes Effective: 12 Jun 2025
Revision History:August 8, 2022: Issued initial notification.November 18, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 9, 2022.Description of Change:Qualification of MTAI as a new final test site for selected SST39LF0xx and SST39VF0xx device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve productivity by qualifying MTAI as a new final test site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF020-70-4I-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--flash--norflash--nor/sst39vf020-70-4i-nhe-microchip-1046380
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF020-70-4I-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--flash--norflash--nor/sst39vf020-70-4i-nhe-microchip-1046380
Microchip SST39VF020-70-4I-NHE - Caractéristiques techniques
| Memory Density: | 2Mb |
| Memory Organization: | 256 K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Style d'emballage : | PLCC-32 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST39VF020-70-4I-NHE is a part of SST39VF Series Multi-Purpose Flash. It comes in 32 pin PLCC package.
The SST39VF020 is a 256 K x8CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
Features:
- Organized as 64K x8 / 128 K x8 / 256 K x8 / 512 K x8
- Single 2.7-3.6 V Read and Write Operations
- Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
- Low Power Consumption (typical values at 14 MHz)
- Active Current: 5 mA (typical)
- Standby Current: 1 µA (typical)
- Sector-Erase Capability
- Uniform 4 KByte sectors
- Fast Read Access Time: 70 ns
- Latched Address and Data
- Automatic Write Timing: Internal VPP Generation
- End-of-Write Detection
- Toggle Bit
- Data# Polling
- CMOS I/O Compatibility
- JEDEC Standard
- Flash EEPROM Pinouts and command sets
View the complete SST39VF Series of Multi-Purpose Flash
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
PLCC-32
Méthode de montage :
Surface Mount