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Référence fabricant
ATSAMD21G17A-MUT
SAMD21G Series 128 kB Flash 16 kB SRAM 48 MHz 32-Bit Microcontroller - QFN-48
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :4000 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip ATSAMD21G17A-MUT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: June 2025
Description of Change:The following updates were performed in this revision:? Updated the document throughout to reflect new silicon revisions H, I, and J? Removed obsolete Data Sheet Clarifications? Added errata Device: 1.5.9 One-Time Programmable LockPlease be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
PCN Status:Final NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 2023
Notification Status: FinalDescription of Change:The following errata were added:– SERCOM: 1.15.15 USART in Auto-Baud Mode– TC: 1.17.3 DMA TriggerImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
4000 par Reel