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Référence fabricant
ATMEGA2560V-8AU
ATmega Series 256 KB Flash 8 KB SRAM 8 MHz 8-Bit Microcontroller - TQFP-100
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Tray Style d'emballage :TQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip ATMEGA2560V-8AU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
**FPCN102817 UPDATE**Revision History:January 03, 2024: Issued initial notification.June 24, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 19, 2024.Description of Change:Qualification of MTAI as a new final test site for selected ATMEGA6450, ATMEGA6490, ATMEGA640, ATMEGA2560, ATMEGA3250, ATMEGA3290 and ATMEGA1280 device families available in 100L TQFP (14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test site.
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Revision History:July 27, 2023: Issued initial notification.February 05, 2024: Updated affected parts list to remove CPN ATMEGA64L-8AQRA1 due to already EOL; Issued cancellation notification.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.
Description of Change: Qualification of MTAI as a new final test site for selected ATMEGA6450, ATMEGA6490, ATMEGA640, ATMEGA2560, ATMEGA3250, ATMEGA3290 and ATMEGA1280 device families available in 100L TQFP (14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test site.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire at MMT assembly site.Change Implementation Status:In Progress
Microchip has released a new Errata for the ATmega640/1280/1281/2560/2561 Silicon Errata and Data Sheet Clarification of devices.Description of Change:The initial release of this document? Errata content moved from the data sheet and restructured to the new document template? Data sheet clarifications added:? Packaging Information: 3.2.1. 100-Ball CBGA? System Clock and Clock Options: 3.3.1. System Clock and Clock Options? Output Compare Modulator: 3.4.1. Output Compare Modulator in ATmega640/1280/1281/2560/2561? Interrupts: 3.5.1. Interrupt Vectors in ATmega640/1280/1281/2560/2561
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying TMGR as an additional fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:March 2022
Statut du produit:
Microchip ATMEGA2560V-8AU - Caractéristiques techniques
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 8kB |
| Speed: | 8MHz |
| No of I/O Lines: | 86 |
| InterfaceType / Connectivity: | EBI/EMI/I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 6 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-100 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
90 par Tray
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount
