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Référence fabricant
2199337-5
ASS'Y FOR MICRO SIM H1.18 8POS (EMBOSS)
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2000 par Reel | ||||||||||
| Code de date: | |||||||||||
TE Connectivity 2199337-5 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of ChangesAssembly location change. Following Part Numbers will be transferred from TE Outside Vendor to other TE Outside Vendor. Only assembly process will be transferred. All components and that tooling is made in TE in house. After assembly process in outside vendor, the product will return back to TE plant, and we inspect it with our procedure.Reason for Change: The transfer is to streamline TE suppliers' management, it enhances the efficiency of supply chain production.
General Product Description:micro sim connector, mini sim connector,Description of Changesshell change manufacuturing to new plating plant location. Along with that, the laser DC mark are changed of shell. please refer to attachment for detail. the change does not effect any Function.First Ship Date of Changed Items (Changed Parts Only): 27-JUN-2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=2199337-5&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/es/p/interconnect--memory-connectors--card-connectors/2199337-5-te-connectivity-6204498
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=2199337-5&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/es/p/interconnect--memory-connectors--card-connectors/2199337-5-te-connectivity-6204498
Emballages disponibles
Qté d'emballage(s) :
2000 par Reel