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Référence fabricant
TC500COE713
TC500 Series 7.5V 16-Bit Precision Analog Front Ends with Dual Slope ADC-SOIC-16
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :SOIC-16 Méthode de montage :Surface Mount |
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Microchip TC500COE713 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC500COE713&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--data-converters--analog-to-digital-converter/tc500coe713-microchip-2250710
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC500COE713&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--data-converters--analog-to-digital-converter/tc500coe713-microchip-2250710
Microchip TC500COE713 - Caractéristiques techniques
| Interface: | 3-Wire |
| No of Channels: | 1 |
| Power Consumption: | 10mW |
| Resolution: | 16b |
| Supply Voltage: | 4.5V to 7.5V |
| Operating Temp Range: | 0°C to 70°C |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | SOIC-16 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
SOIC-16
Méthode de montage :
Surface Mount