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Référence fabricant
MIC2005A-1YM6-TR
MIC2005 Series 1 Channel 5.5V 500mA High Side Power Distribution Switch SOT-23-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2005A-1YM6-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 06, 2022: Issued initial notification.January 23, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 28, 2023.Description of Change:Qualification of G700 as a new mold compound material for selected MIC20xxx and MIC5159 device families available in 6L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 as a new mold compound material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2005A-1YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--power-switches/mic2005a-1ym6-tr-microchip-9005849
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2005A-1YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--power-switches/mic2005a-1ym6-tr-microchip-9005849
Microchip MIC2005A-1YM6-TR - Caractéristiques techniques
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 220mΩ |
| Rated Current-Max: | 500mA |
| Type: | Power Distribution Switch |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount