Référence fabricant
SST39WF1602-70-4C-B3KE
SST39WF Series 16 Mbit 1M x 16 1.85 V Multi-Purpose Flash Plus - TFBGA-48
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :480 par Tray Style d'emballage :TFBGA-48 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SST39WF1602-70-4C-B3KE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***July 26, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 23, 2024***Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Statut du produit:
Microchip SST39WF1602-70-4C-B3KE - Caractéristiques techniques
| Memory Density: | 16Mb |
| Memory Organization: | 1 M x 16 |
| Supply Voltage-Nom: | 1.65V to 1.95V |
| Access Time-Max: | 70ns |
| Style d'emballage : | TFBGA-48 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
480 par Tray
Style d'emballage :
TFBGA-48
Méthode de montage :
Surface Mount