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Référence fabricant
MIC5209YML-TR
MIC5209 Series 500 mA ADJ Output Voltage SMT Low-Noise LDO Regulator - MLF-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5209YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5209YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/3621703
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5209YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/3621703
Microchip MIC5209YML-TR - Caractéristiques techniques
| Input Voltage-Min: | 2.5V |
| Input Voltage-Max: | 16V |
| Output Voltage Range: | 1.8V to 15V |
| Dropout Voltage-Max: | 600mV |
| Output Current-Max: | 500mA |
| Rated Power: | 1.56W |
| Tolerance (%): | ±1% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Adjustable |
| No. of Outputs: | Single |
| Load Regulation (%): | 0.7% |
| Current - Limit: | 1000mA |
| Line Regulation (%): | 0.1% |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Designed especially for hand-held, battery-powered devices, the MIC5209 features low ground current to help prolong battery life. An enable/shutdown pin on SO-8 and TO-263-5 versions can further improve battery life with near-zero shutdown current.
Key features include reversed-battery protection, current limiting, over temperature shutdown, ultra-low-noise capability (SO-8 and TO-263-5 versions), and availability in thermally efficient packaging. The MIC5209 is available in adjustable or fixed output voltages.
Features:
- Meets Intel® Slot 1 and Slot 2 requirements
- Guaranteed 500 mA output over the full operating
- temperature range
- Low 500 mV maximum dropout voltage at full load
- Extremely tight load and line regulation
- Thermally-efficient surface-mount package
- Low temperature coefficient
- Current and thermal limiting
- Reversed-battery protection
- No-load stability
- 1% output accuracy
- Ultra-low-noise capability in SO-8 and TO-263-5
Applications:
- Pentium II Slot 1 and Slot 2 support circuits
- Laptop, notebook, and palmtop computers
- Cellular telephones
- Consumer and personal electronics
- SMPS post-regulator/dc-to-dc modules
- High-efficiency linear power supplies
To learn more about the MIC5209 product family, Click Here
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount
