Référence fabricant
MIC2003-0.5YML-TR
MIC2003 Series 1 Channel 5.5V 500mA High Side Power Distribution Switch - MLF-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2003-0.5YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Statut du produit:
Microchip MIC2003-0.5YML-TR - Caractéristiques techniques
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 100mΩ |
| Rated Current-Max: | 0.5A |
| Type: | Power Distribution Switch |
| Style d'emballage : | MLF-6 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC2003-0.5YM5 TR is a current limiting, high-side power switches that are designed for general purpose power distribution and control in PCs, PDAs, printers and other self-powered systems.
The MIC2003 and MIC2013’s main function is current limiting. They are thermally protected and will shut down should their internal temperature reach unsafe levels, protecting both the device and the load, under high current or fault conditions. Both devices are fully self-contained, with the current limit value being factory set to one of several convenient levels. The MIC2013 offers a unique new feature: Kickstart™, which allows momentary high current surges to pass unrestricted without sacrificing overall system safety. The MIC2003 and MIC2013 are excellent choices for USB and IEEE 1394 (FireWire) applications or for any system where current limiting and power control are desired. The MIC2003 and MIC2013 are offered in space saving 6 pin, SOT-23 and 2 mm x 2 mm MLF packages.
Key Features:
- 70 mO typical on-resistance
- 2.5 V - 5.5 V operating range
- Pre-set current limit values: 0.5 A, 0.8 A and 1.2 A
- Kickstart™
- Thermal Protection
- Under voltage lock-out
- Low quiescent current
Applications:
- USB / IEEE 1394 Power Distribution
- Desktop and Laptop PCs
- Set top boxes
- Game consoles
- PDAs
- Printers
- Docking stations
- Chargers
To learn more about the MIC2003-0.5YM5 TR product family, Click Here.
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-6
Méthode de montage :
Surface Mount