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Référence fabricant
MIC94062YMT-TR
MIC94062 Series 5.5 V 110 mOhm Surface Mount High Side Power Switch - TMLF-4
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :TMLF-4 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC94062YMT-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*** Update for PCN 115136/Location Change ***Description of Change: Qualification of UNIG as an additional final test location and scan and pack site for selected MIC5302, MIC94062, MIC5303, MIC94073, MIC94065, MIC94064, MIC5327, MIC5337, MIC94072, MIC94063, MIC94071, MIC94070, MIC94060, MIC94061, and MIC842 device families available in 4L UDFN (1.2x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 29 August 2025 (date code: 2535)Revision History:June 26, 2025: Issued initial notification.July 04, 2025: Re-issued initial notification to update the pre and post change for tape and reel width max from N/A to 9.9mm.August 5, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 29, 2025. August 28, 2025: Re-issued final notification to update the pre and post change for tape and reel carrier tape thickness from 0.2+/-0.02 mm to 0.254+/-0.02 mm and reflect the correct tape and reel carrier tape dimensions for UNIG.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
*** Update for PCN 114200 ***Revision History:June 26, 2025: Issued initial notification.July 04, 2025: Re-issued initial notification to update the pre and post change for tape and reel width max from N/A to 9.9mm.August 5, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 29, 2025. Description of Change: Qualification of UNIG as an additional final test location and scan and pack site for selected MIC5302, MIC94062, MIC5303, MIC94073, MIC94065, MIC94064, MIC5327, MIC5337, MIC94072, MIC94063, MIC94071, MIC94070, MIC94060, MIC94061, and MIC842 device families available in 4L UDFN (1.2x1.6x0.6mm) packageReason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 29 August 2025 (date code: 2535)
***UPDATE OF PCN113918***Description of Change: Qualification of UNIG as an additional final test location and scan and pack site for selected MIC5302, MIC94062, MIC5303, MIC94073, MIC94065, MIC94064, MIC5327, MIC5337, MIC94072, MIC94063, MIC94071, MIC94070, MIC94060, MIC94061, and MIC842 device families available in 4L UDFN (1.2x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated Qualification Completion Date: July 2025Revision History: June 26, 2025: Issued initial notification.July 04, 2025: Re-issued initial notification to update the pre and post change for tape and reel width max from N/A to 9.9mm.
Description of Change: Qualification of UNIG as an additional final test location and scan and pack site for selected MIC5302, MIC94062, MIC5303, MIC94073, MIC94065, MIC94064, MIC5327, MIC5337, MIC94072, MIC94063, MIC94071, MIC94070, MIC94060, MIC94061, and MIC842 device families available in 4L UDFN (1.2x1.6x0.6mm) package.Final Test Site:Pre Change:Unisem Chengdu Co.,Ltd.Post Change:Unisem Chengdu Co.,Ltd.Unisem Gopeng
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC94062YMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--power-switches/mic94062ymt-tr-microchip-1746379
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC94062YMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--power-switches/mic94062ymt-tr-microchip-1746379
Microchip MIC94062YMT-TR - Caractéristiques techniques
| Configuration: | High Side |
| No of Elements: | Single |
| On-state Resistance-Max: | 110mΩ |
| Rated Current-Max: | 2A |
| Style d'emballage : | TMLF-4 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This device come with maximum turn on delay time of 1200 µs and maximum turn on rise time of 1500 µs. and features an active load discharge circuit which insures capacitive loads retain no charge when the main switch is in an OFF state.
Features:
- 1.7 V to 5.5 V input voltage range
- 2 A continuous operating current
- 77 mΩ (typ) RON
- Built-in level shift for control logic; can be operated by 1.5 V logic.
- Low 2 μA quiescent current
- Soft-Start: MIC94062-63
- Micro-power shutdown <1 μA
- Load discharge circuit: MIC94061
- Space saving 1.2x1.6 mm Thin MLF package
Applications:
- Load switch in portable applications:
- Cellular phones
- PDAs
- MP3 players
- Digital Cameras
- Portable instrumentation
- Battery switch-over circuits
- Level translator
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
TMLF-4
Méthode de montage :
Surface Mount