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Référence fabricant
APTGLQ600A65T6G
APTGLQ60x Series 650 V 1200 A High Speed Trench + Field Stop IGBT4 Power module
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Tube Style d'emballage :SP-6 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip APTGLQ600A65T6G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Implement new protective packing material changes (Rivet) for selected MSCSMxx, CMCOSxx, CMGESxx, APTM1xx, APTGFxx, CMFIGxx, CMANGxx, MSCGLxx, APTGTxx, APTGLxx, CMTFGxx, CMAOGxx, CMPWGxx, CMGIGxx, CMCLGxx, APTGXxx, CMBBGxx, APTM2xx, APTM5xx, CMTTMxx, CMHIMxx, CMARMxx, APTGRxx, MSCM1xx, CMKLMxx, CMBAMxx, CMAOMxx, and APTC6xx device families available in Module package at MP3B assembly site.
Description of Change: Qualification of INMK as an additional fabrication site for selected APT100GLQ65Jxxx, APT50GLQ65JU2, APTGLQxxx, CMTDGLQxxx, MSCGLQxxx, CMGIGLQ300xxx, CMHS50GLQ65JCU2 and CMMIGLQ100X065CTYZBNMG device families available in 650V IGBT3 High Speed and Medium Power bare die products.Reason for Change:To improve on-time delivery performance by qualifying INMK as an additional fabrication site.
Revision History:January 27, 2023: Issued initial notification.September 11, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 25, 2023. Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP6 package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP6 packageReason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APTGLQ600A65T6G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--igbts/aptglq600a65t6g-microchip-2034603
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APTGLQ600A65T6G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--igbts/aptglq600a65t6g-microchip-2034603
Microchip APTGLQ600A65T6G - Caractéristiques techniques
| CE Voltage-Max: | 650V |
| Collector Current @ 25C: | 770A |
| Power Dissipation-Tot: | 2000W |
| Gate - Emitter Voltage: | ±20V |
| Pulsed Collector Current: | 1500A |
| Collector - Emitter Saturation Voltage: | 1.85V |
| Turn-on Delay Time: | 19ns |
| Turn-off Delay Time: | 197ns |
| Qg Gate Charge: | 3500nC |
| Reverse Recovery Time-Max: | 125ns |
| Leakage Current: | 300µA |
| Input Capacitance: | 36.6nF |
| Thermal Resistance: | 0.075°C/W |
| Operating Temp Range: | -40°C to +175°C |
| Style d'emballage : | SP-6 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1 par Tube
Style d'emballage :
SP-6
Méthode de montage :
Through Hole