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Référence fabricant
SI2307CDS-T1-BE3
-30V,3.5A,88MOHM,SOT-23
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| Nom du fabricant: | Vishay | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Vishay SI2307CDS-T1-BE3 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description:No Physical, Process, or Location Changes We want to emphasize that products continue to be manufactured at the same locations, using the same equipment, materials, packaging, and process steps as before. There have been no changes to any aspect of the production process or sites involved.BackgroundThis alignment is part of a global initiative at Vishay to ensure consistent representation of CoO information across all divisions, based on international and national regulations, as well as World Trade Organization guidelines.Please NoteSome customers may have already noticed changes in the CoO information on documentation accompanying recent product deliveries. As part of this ongoing initiative, updates to the CoO may continue to appear over time in product documentation, where applicable. These changes align with the updated approach and do not reflect any physical changes to the products themselves.
Description of Change: To meet the increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer BGBM process (Backside-Grind and Backside-Metallization) for commercial Low-Voltage Power MOSFETs at in-house Siliconix Philippines Inc.(SPI) facility in Binan, Philippines.Reason for Change: Capacity Expansion
Description of Change: To meet increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer back-grind and back-metallization (BGBM) on select commercial Power MOSFET in SOT-23 and TSOP6 packages at Prosperity Power Technology Inc. (ProPowertek, previously IST).ProPowertek, founded at the Hsinchu Science Park in Nov?20, aims to provide customers with engineering services for the center- and backend wafer making process, and is devoted to leading the world in this market. ProPowertek is focusing on wafer thinning engineering, front side metal (FSM), backside grinding backside metal (BGBM), and IGBT back-end Turnkey solution in the local IC industry chain. ProPowertek has achieved ISO9001, ISO14001, ISO45001, and IATF16949 certifications for quality management systems. Classification of Change: Manufacturing Capacity ExpansionExpected Influence on Quality/Reliability/Performance: There will be no effect on quality, reliability, performance, and the minimum/maximum values in the datasheet.Vishay Brand(S): Vishay SiliconixTime Schedule:Start Shipment Date: Mon May 22, 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SI2307CDS-T1-BE3&field4=Vishay&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/si2307cds-t1-be3-vishay-3128484
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SI2307CDS-T1-BE3&field4=Vishay&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/si2307cds-t1-be3-vishay-3128484
Vishay SI2307CDS-T1-BE3 - Caractéristiques techniques
| Product Status: | Active |
| Fet Type: | P-Ch |
| No of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 30V |
| Drain-Source On Resistance-Max: | 88Ω |
| Rated Power Dissipation: | 1.1W |
| Qg Gate Charge: | 6.2nC |
| Gate-Source Voltage-Max [Vgss]: | 20V |
| Drain Current: | 2.7A |
| Turn-on Delay Time: | 5.5ns |
| Turn-off Delay Time: | 17ns |
| Rise Time: | 13ns |
| Fall Time: | 7.7ns |
| Operating Temp Range: | -55°C to +150°C |
| Gate Source Threshold: | 3V |
| Input Capacitance: | 340pF |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Méthode de montage :
Surface Mount