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Référence fabricant
TN5335K1-G
TN5335 Series Single N-Channel 350 V 15 Ohm 0.36 W Silicon Mosfet - SOT-23
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23 (SC-59,TO-236) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TN5335K1-G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 111842 /Location Change***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 08 October 2025 (date code: 2541)Revision History: March 26, 2025: Issued initial notification. September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 08, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TN5335K1-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/tn5335k1-g-microchip-6055968
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TN5335K1-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/tn5335k1-g-microchip-6055968
Microchip TN5335K1-G - Caractéristiques techniques
| Fet Type: | N-Ch |
| No of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 350V |
| Drain-Source On Resistance-Max: | 15Ω |
| Rated Power Dissipation: | 0.36W |
| Gate-Source Voltage-Max [Vgss]: | 20V |
| Drain Current: | 750mA |
| Turn-on Delay Time: | 20ns |
| Turn-off Delay Time: | 25ns |
| Rise Time: | 15ns |
| Fall Time: | 25ns |
| Operating Temp Range: | -55°C to +150°C |
| Gate Source Threshold: | 2V |
| Technology: | Si |
| Height - Max: | 1.02mm |
| Length: | 3.04mm |
| Input Capacitance: | 110pF |
| Style d'emballage : | SOT-23 (SC-59,TO-236) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount