Référence fabricant
IMBG65R163M1HXTMA1
650 V 17A 85W N-Channel SMT CoolSiCTM M1 SiC Trench Power MOSFET-PG-TO263-7-12
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :PG-TO-263-7 Méthode de montage :Surface Mount |
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Infineon IMBG65R163M1HXTMA1 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Subject CoolSiCTM 650V G1 SiC datasheets revision updatesReason: (1) Naming and nomenclature update according to IEC 60747-8 Amd.1 Ed.3.03 from 2020(2) Update Tj,max from 150?C to 175?C for the following products:IMW65R027M1H, IMW65R048M1H,IMW65R072M1H,IMW65R107M1H,IMZA65R027M1H, IMZA65R048M1H,IMZA65R072M1H and IMZA65R107M1H(3) Extend the VGS(static) and VGS(dynamic) specs of products reported in Table 1 in TO247-3pin and TO247-4pin package.(4) Datasheet template harmonization with respect to CoolSiCTM MOSFET 650V G2
Statut du produit:
Infineon IMBG65R163M1HXTMA1 - Caractéristiques techniques
| Technology: | SiCFET (Silicon Carbide) |
| Product Status: | Active |
| Fet Type: | N-Ch |
| No. of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 650V |
| Drain Current: | 17A |
| Input Capacitance: | 320pF |
| Power Dissipation: | 85W |
| Operating Temp Range: | -55°C to +175°C |
| Style d'emballage : | PG-TO-263-7 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
PG-TO-263-7
Méthode de montage :
Surface Mount