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Référence fabricant
MSC015SMA070B4
MSC015 Series 700 V 140 A 19 mOhm Single N-Channel SiC Power MOSFET - TO-247-4
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :30 par Style d'emballage :TO-247-4 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip MSC015SMA070B4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN111361***Description:Implement packing material changes for selected PSDS and SIC products available on TO-220, TO-247 and TO-263 packages at FSTS final test site.Reason for Change: To improve productivity by implementing packing material changes for selected PSDS and SIC products.Estimated First Ship Date: 16 June 2025 (date code: 2525)Revision History: March 06, 2025: Issued initial notification.June 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 16, 2025.
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
Description of Change:• Updated values for IDM and PD in Table 1-1.• Updated values in Table 1-2.• Added tM symbol for mounting torque in Table 1-2.• Added VGS(th) (Max.) value in Table 1-3.• Updated ID value (Test Conditions) in Table 1-4.• Added VSD (Max.) value in Table 1-5.• Updated ISD value (Test Conditions) in Table 1-5.• Updated Typical Performance Curves and Package Outline Drawing.Reason for Change: To improve productivity.
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 09, 2023: Issued initial notification.December 05, 2023: Re-issued initial notification to add MSC025SMA120D/S-C25, MSC017SMA120D/S-C25, MSC040SMA120D/S-C25, MSC080SMA120D/S-C25,MSC015SMA070D/S-C25, MSC060SMA070D/S-C25, MSC035SMA170D/S-C25 catalog part numbers (CPNs) in the affected parts list.Revision of Qual Report Availability and Final PCN Issue Date from “September 29, 2023” to “August 30, 2024”.Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 devicefamilies in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=fr&field2=MSC015SMA070B4&field4=Microchip&field18=https://p1emea.futureelectronics.com/fr/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc015sma070b4-microchip-1147609
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=fr&field2=MSC015SMA070B4&field4=Microchip&field18=https://p1emea.futureelectronics.com/fr/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc015sma070b4-microchip-1147609
Microchip MSC015SMA070B4 - Caractéristiques techniques
| Technology: | SiCFET (Silicon Carbide) |
| Product Status: | Active |
| Fet Type: | N-Ch |
| No. of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 700V |
| Drain Current: | 140A |
| Input Capacitance: | 4500pF |
| Power Dissipation: | 455W |
| Operating Temp Range: | -55°C to +175°C |
| Style d'emballage : | TO-247-4 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
30 par
Style d'emballage :
TO-247-4
Méthode de montage :
Through Hole