Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
SY89809ALTZ-TR
SY89809 Series 3.3 V LVPECL/ HSTL to HSTL 1:9 High Performance Clock Driver
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :TQFP-32 Méthode de montage :Surface Mount |
||||||||||
| Code de date: | |||||||||||
Microchip SY89809ALTZ-TR - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Statut du produit:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY89809ALTZ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--timing-solutions--high-bandwidth/sy89809altz-tr-microchip-5007424
-
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY89809ALTZ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--timing-solutions--high-bandwidth/sy89809altz-tr-microchip-5007424
Microchip SY89809ALTZ-TR - Caractéristiques techniques
| Input Voltage-Max: | 4.28V |
| Temperature Range: | 0°C to 85°C |
| Supply Voltage-Nom: | 3V to 3.6V |
| Frequency-Max: | 750MHz |
| Style d'emballage : | TQFP-32 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
TQFP-32
Méthode de montage :
Surface Mount