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Référence fabricant
24FC128-I/ST
CMOS Serial EEPROM I2C,128Kb (16K x 8), 1.7-5.5V, I-Temp, 8-Pin TSSOP.
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :TSSOP-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip 24FC128-I/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
****FPCN110511 UPDATE****Description of Change: Qualification of new bill of materials (BOM) for selected 24LC128, 24AA128, 24FC128 and AT24C128C device families available in 8L TSSOP (4.4mm) package assembled at ANAP, ASSH and MMT assembly sites.Reason for Change: To improve manufacturability by qualifying new bill of materials (BOM) assembled at ANAP, ASSH and MMT assembly sites.
Description of Change: Qualification of CuPdAu as a new wire material and AMK-EP27 as a new die attach material for selected 24LC128, 24AA128, 24FC128 and AT24C128C device families available in 8LTSSOP (4.4mm) package assembled at ANAP, ASSH and MMT assembly sites.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and AMK-EP27 as a new die attach material.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Statut du produit:
Microchip 24FC128-I/ST - Caractéristiques techniques
| Memory Density: | 128kb |
| Memory Organization: | 16 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | TSSOP-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount