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Référence fabricant
24LC08BT-I/OT
24LC08 Series 8 Kb I2C 2 Wire (1K X 8) 2.5 V Serial EEPROM SMT - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2530 | ||||||||||
Microchip 24LC08BT-I/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Microchip has released a new Datasheet for the 24AA08/24LC08B/24FC08 - 8-Kbit I?C Serial EEPROM of devices.Added 4 million E/W cycles for FC devices only; Minor editorial updates throughout the document.Reason for Change: To Improve Productivity.Date Document Changes Effective: 02 Oct 2025
**Update to FPCN113837**Revision History: June 20, 2025: Issued initial notification. August 08, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on August 31, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA01x, 24AA02x, 24AA04x, 24AA08x, 24AA16x, 24FC01, 24FC02, 24FC04x, 24FC08, 24FC16x, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, AT24C01D, AT24C02D, AT24C04D, AT24C08D, AT24C16D and AT24C32E device families available in 5L SOT-23 package.Reason for Change: To improved manufacturability by qualifying CuPdAu as a new wire material.
Description of Change:Qualification of CuPdAu as a new wire material for selected 24AA01x, 24AA02x, 24AA04x, 24AA08x, 24AA16x, 24FC01, 24FC02, 24FC04x, 24FC08, 24FC16x, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, AT24C01D, AT24C02D, AT24C04D, AT24C08D, AT24C16D and AT24C32E device families available in 5L SOT-23 package.Pre and Post Summary Changes: See attachedImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improved manufacturability by qualifying CuPdAu as a new wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: July 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=24LC08BT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24lc08bt-i-ot-microchip-2522670
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=24LC08BT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24lc08bt-i-ot-microchip-2522670
Microchip 24LC08BT-I/OT - Caractéristiques techniques
| Memory Density: | 8kb |
| Memory Organization: | 1 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 24LC08B (24XX08*) series of 8 Kbit Electrically Erasable PROM is organized as four blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V, with standby and active currents of only 1 µA and 1 mA, respectively.
The 24XX08 also has a page write capability for up to 16 bytes of data. The 24XX08 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN, 2x3 TDFN and MSOP packages, and is also available in the 5-lead SOT-23 package. All packages are Pb-free and RoHS compliant.
Features:
- Single Supply with Operation Down to 2.5 V
- Low-Power CMOS Technology:
- 2-Wire Serial Interface, I2C™ Compatible
- Schmitt Trigger inputs for Noise Suppression
- Output Slope Control to eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- Page Write Time 3 ms, typical
- Self-Timed Erase/Write Cycle
- 16-Byte Page Write Buffer
- Hardware Write-Protect
- ESD Protection >4,000 V
- More than 1 Million Erase/Write Cycles
- Data Retention >200 years
Learn more about the 24LC08B family of EEPROM
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount