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Référence fabricant
AT24C512C-XHD-B
AT24C512C Series 512 Kb (64 K x 8 ) 5.5 V I2C-Compatible Serial EEPROM - TSSOP-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :TSSOP-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2325 | ||||||||||
Microchip AT24C512C-XHD-B - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT24C512C-XHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c512c-xhd-b-microchip-9080550
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT24C512C-XHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c512c-xhd-b-microchip-9080550
Microchip AT24C512C-XHD-B - Caractéristiques techniques
| Memory Density: | 512kb |
| Memory Organization: | 64 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Supply Current: | 3mA |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 100 yr |
| Interface Type: | 2-Wire |
| Access Time-Max: | 450ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Style d'emballage : | TSSOP-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount