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Référence fabricant
SST25VF040B-50-4I-S2AF
SST25VF Series 4 Mbit 512 K x 8 3 V Surface Mount SPI Serial Flash - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :90 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount |
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| Code de date: | 2542 | ||||||||||
Microchip SST25VF040B-50-4I-S2AF - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Statut du produit:
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Microchip SST25VF040B-50-4I-S2AF - Caractéristiques techniques
| Clock Frequency-Max: | 50MHz |
| Memory Density: | 4Mb |
| Memory Organization: | 512 K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The SST25VF040B-50-4I-S2AF is a part of SST25VF series SPI Serial Flash. It has an standard industria operating temperature ranging from -40°C to +85°C, it comes in SOIC-8 package.
The 25 series Serial Flash family features a four-wire, SPIcompatible interface that allows for a low pin-count package which occupies less board space and ultimately lowers total system costs. These devices are enhanced with improved operating frequency for lower power consumption. The SST25VF040B SPI serial flash memories are manufactured with SST proprietary, high-performance CMOS SuperFlash technology.
Features:
- Serial Interface Architecture – SPI Compatible: Mode 0 and Mode 3
- Low Power Consumption: – Active Read Current: 10 mA (typical) – Standby Current: 5 µA (typical)
- Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 32 KByte overlay blocks – Uniform 64 KByte overlay blocks
- Fast Erase and Byte-Program: – Chip-Erase Time: 35 ms (typical) – Sector-/Block-Erase Time: 18 ms (typical) – Byte-Program Time: 7 µs (typical)
- Auto Address Increment (AAI) Programming – Decrease total chip programming time over Byte-Program operations
- Packages Available – 8-lead SOIC (200 mils) – 8-lead SOIC (150 mils) – 8-contact WSON (6mm x 5mm)
- All devices are RoHS compliant
View the complete family of SST25VF series SPI Serial Flash
Emballages disponibles
Qté d'emballage(s) :
90 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount