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Référence fabricant
DSPIC33FJ256MC710A-E/PF
dsPIC33F Series 30 kB RAM 256 kB Flash 16-Bit Digital Signal Controller-TQFP-100
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Tray Style d'emballage :TQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip DSPIC33FJ256MC710A-E/PF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:August 10, 2023: Issued initial notification.June 05, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 23, 2025. Updated the notification subject and description change.Note: The change described in this PCN does not alter Microchip's current regulatory compliance regarding the material content of the applicable product.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected dsPIC33FJ6xx, PIC18F96J6xx, PIC18F97J6xx, PIC24FJ64Gxx, PIC24FJ128xx, PIC24FJ192xx, PIC24FJ256xx, PIC24FJ96Gxx, dsPIC33FJ2xx, PIC24HJ64Gxx, dsPIC33FJ1xx, PIC24HJ128xx, PIC24HJ256xx and dsPIC33FJ3xx device families available in 64L and 100L TQFP (14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire asnew wire material for selected DSPIC33FJ128xxx, DSPIC33FJ256xxx, DSPIC33FJxxGSxxx,DSPIC33FJxxMxxx, PIC18F9xJxx and PIC24FJxxxGxxx device families available in 64L and 100L TQFP(14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with goldflash (CuPdAu) bond wire.
Statut du produit:
Microchip DSPIC33FJ256MC710A-E/PF - Caractéristiques techniques
| Family Name: | dsPIC33F |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 30kB |
| No of I/O Lines: | 85 |
| InterfaceType / Connectivity: | CAN/IrDA/I2C/LIN/SPI/UART |
| Peripherals: | DMA/POR/PWM/QEI/Watchdog |
| Number Of Timers: | 9 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 24-chx10-bit / 24-chx12-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-100 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
90 par Tray
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount