Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
CYT2B73BADQ0AZEGST
Traveo II, AUTOMCU
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1500 par Reel | ||||||||||
| Code de date: | |||||||||||
Infineon CYT2B73BADQ0AZEGST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change information:Subject: Errata update affecting TRAVEO products.Reason:Update of Errata sheets to include:? TVII RTC Busy Status bit stuck issue? Ethernet RGMII external mode issue? ARM Errata for CM7 r1p1 - impact analysis for affected chips? Cortex M4 IP Errata for Traveo-II (TVII-B-E-1M / CYT2B7) chip
Detailed change informationReason/Motivation:Expansion of final test to assure continuity of supply and enable flexible manufacturing. Data sheet change due to update of specification.DescriptionDATA SHEET: Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specificationTEST FLOW: Move of all or part of electrical wafer test and/or final test to a different test site.Intended start of delivery [1] : 2026-03-02Last order date (LOD) [2] : 2026-03-02Last delivery date (LDD) [3] : 2026-09-01
Detailed change informationSubject Update of Technical Reference Manual (TRM) affecting dedicated Traveo and PSoC productsDescription Old - Not applicableNew- PSoC 4 HVMS 128K TRM- Traveo II Body TRMReason:First version of TRM in MyICP, to consolidate the Traveo documentation migration in Legacy Infineon document database
Description:*Die attach material change*Change of mold compound / encapsulation material*Change of product marking*Move all or parts of production to a different assembly site*Change of carrier (tray, reel)*Move of all or part of electrical wafer test and/or final test to a different test siteReason:Capacity expansion of BE assembly to Advanced Semiconductor Engineering, Inc., Kaohsiung, Taiwan (ASE) to assure continuity of supply and enable flexible
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
1500 par Reel