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Référence fabricant
PIC16C716-04E/SO
PIC16C Series 3.5 KB Flash 128 B RAM SMT 8-Bit Microcontroller - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :42 par Tube Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2117 | ||||||||||
Microchip PIC16C716-04E/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16C716-04E/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16c716-04e-so-microchip-4527990
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16C716-04E/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16c716-04e-so-microchip-4527990
Microchip PIC16C716-04E/SO - Caractéristiques techniques
| Family Name: | PIC16C |
| Core Processor: | PIC |
| Program Memory Type: | OTP |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128B |
| Speed: | 4MHz |
| No of I/O Lines: | 13 |
| Peripherals: | On-Chip-ADC/PWM/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2.5V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 4-chx8-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This powerful (200 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS OTP-based 8-bit microcontroller packs Microchip's powerful PIC® architecture into an 18-pin package and is upwards compatible with the PIC16C5X and PIC12CXXX devices.
The PIC16C716 features 4 channels of 8-bit Analog-to-Digital (A/D) converter with 2 additional timers and a capture/compare/PWM function that make it ideal for more advanced level A/D applications in automotive, industrial, appliances and consumer applications.
Features:
- High-Performance RISC CPU:
- Only 35 single word instructions to learn
- All single-cycle instructions except for program branches which are two cycle
- Operating speed:
- DC - 20 MHz clock input
- DC - 200 ns instruction cycle
- Peripheral Features:
- Timer0: 8-bit timer/counter with 8-bit prescaler
- Timer1: 16-bit timer/counter with prescaler can be incremented during Sleep via external crystal/clock
- Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
- CMOS Technology:
- Low-power, high-speed CMOS EPROM technology
- Fully static design
- In-Circuit Serial Programming™ (ICSP™)
- Wide operating voltage range: 2.5 V to 5.5 V
- High Sink/Source Current 25/25 mA
- Commercial, Industrial and Extended temperature ranges
To learn more about the PIC16C71x series product , Click Here
Emballages disponibles
Qté d'emballage(s) :
42 par Tube
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount
