
Référence fabricant
PIC18F25K42-I/SS
IC MCU 8BIT 32KB FLASH 28SSOP
Microchip PIC18F25K42-I/SS - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Product Documents for the PIC18(L)F24/25K42 Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:1. Added Modules 2.5 Double Sample Conversions; 13 Central Processing Unit (CPU); and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 April 2022
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
47 par Tube