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Référence fabricant
RNBD451PE-I100
Bluetooth Modules - 802.15.1 BLE RN module, PCB antenna, Industrial temp
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :72 par Bulk Style d'emballage :Module Méthode de montage :Surface Mount |
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Microchip RNBD451PE-I100 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Implement Top Marking Change for RNBD451PE-I100, WBZ451PE-I, WBZ451UE-I, WBZ451PE-IA2, WBZ451UE-IA2, RNBD451PE-I110, WBZ451PE-E, and RNBD451PE-I catalog part numbers (CPN) available in 39L MODULE (15.5x20.7mm) package.Reason for Change: To improve productivity by implementing top marking changes.Estimated First Ship Date: 15 October 2025 (date code: 2542)
Microchip has released a new Datasheet for the RNBD451 Bluetooth® Low Energy Module Data Sheet of devices. If you are using one of these devices please read the document located at RNBD451 Bluetooth® Low Energy Module Data Sheet.Data Sheet - RNBD451 Bluetooth® Low Energy Module Data SheetNotification Status: FinalDescription of Change:Introduction - Minor updateFeatures - Minor updateRF/Analog Features - Minor update1.1. Reference Documentation - Added the reference link2.1. RNBD451 Module Ordering Information - Minor update3.1. Module Overview - Updated the pin diagram and pin details table3.2. Module Configuration - Minor update4.1. Absolute Maximum Electrical Characteristics - Minor update4.2. DC Electrical Characteristics - Minor update4.3. Active Current Consumption DC Electrical Specifications - Updated the plot; Removed few notes4.4. Sleep Current Consumption DC Electrical Specifications - Updated the plot; Removed few notes4.5. Deep Sleep Current Consumption DC Electrical Specifications - Updated the plot; Removed few notes4.6. XDS (Extreme Deep Sleep) Current Consumption DC Electrical Specifications - Updated the plot; Removed few notes4.7. Power Supply DC Module Electrical Specifications - Removed few characteristics; Removed few notes4.8. I/O PIN AC/DC Electrical Specifications - Minor update4.9. ADC Electrical Specifications - Minor update4.10. Bluetooth Low Energy RF Characteristics - Updated the “Bluetooth Low Energy 1M CI Margin” plot; Minor update5. Basic Connection Requirement - Updated the figure5.1. Power Pins - Minor update5.2. Master Clear (NMCLR) Pin - Minor update5.3. Unused I/O Pins - Minor update5.3.1. GPIO Pins Functions - Minor update6.1. RNBD451 Module Placement Guidelines - Minor update6.5.1. PCB Antenna - Minor updateFigure 8-1 - Updated the figure7. ASCII Command API - Removed the commands10. Appendix A: Regulatory Approval - Added the following countries: 10.4. Japan, 10.5. Korea, 10.6. Taiwan, 10.7. China, 10.8.2. UKCA Declaration of ConformityImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Nov 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=RNBD451PE-I100&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--wireless-rf--rf-modules-solutions--bluetooth/rnbd451pe-i100-microchip-3175777
Microchip RNBD451PE-I100 - Caractéristiques techniques
| Max Power Consumption: | 96.7mA |
| Certified: | Yes |
| Sensitivity: | -102dBm |
| Frequency Range: | 2.48GHz to 2.402GHz |
| Supply Voltage: | 1.9V to 3.6V |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 39 |
| Style d'emballage : | Module |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
72 par Bulk
Style d'emballage :
Module
Méthode de montage :
Surface Mount
