Référence fabricant
MIC4124YML-TR
MIC4124 Series 20 V 2.5 Ω 3 A Dual Non Inverting Low Side Mosfet Driver - MLF-8
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC4124YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**FPCN98053 UPDATE***Revision History:May 12, 2023: Issued initial notification.June 24, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 15, 2024.Description of Change:Qualification of UNIG as a new final test site for MIC412xYME, MIC412xYML and MAQ412xYME device families available in 8L SOIC (3.9mm) and 8L VDFN (4x4x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
Microchip MIC4124YML-TR - Caractéristiques techniques
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 2.3Ω |
| Peak Output Current: | 3A |
| Supply Voltage-Max: | 20V |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This device is capable of giving reliable service in more demanding electrical environments than their predecessors. It will not latch under any conditions within their power and voltage ratings and can survive up to 5 V of noise spiking, of either polarity, on the ground pin.
Features:
- Reliable, low-power bipolar/CMOS/DMOS construction
- Latch-up protected to >200 mA reverse current
- Logic input withstands swing to –5 V
- High 3 A-peak output current
- Wide 4.5V to 20V operating range
- Drives 1800 pF capacitance in 25 ns
- Short <50 ns typical delay time
- Delay times consistent with in supply voltage change
- Matched rise and fall times
- TTL logic input independent of supply voltage
- Low equivalent 6pF input capacitance
- Low supply current
- 3.5mA with logic-1 input
- 350μA with logic-0 input
- Low 2.3Ω typical output impedance
- Output voltage swings within 25 mV of ground or VS
- ‘426/7/8-, ‘1426/7/8-, ‘4426/7/8-compatible pinout
- Inverting, noninverting, and differential configurations
- Exposed backside pad packaging reduces heat
- ePAD SOIC-8L (θJA = 58 °C/W)
- 4 mm x 4 mm MLF-8L (θJA = 45 °C/W)
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount