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Référence fabricant
MIC2039AYMT-TR
ADJ, HIGH-SIDE, POWER DISTRIBUTION SWITCH
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :UDFN-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2039AYMT-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*** Update for PCN 112321 ***Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5219, MIC5323, MIC5305, MIC5325, MIC2033, MIC2039, and MIC2790 device families available in 6L UDFN (2x2x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Estimated First Ship Date: 09 July 2025 (date code: 2528)Revision History: April 09, 2025: Issued initial notification.June 06, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 09, 2025.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5219, MIC5323, MIC5305, MIC5325, MIC2033, MIC2039, and MIC2790 device families available in 6L UDFN (2x2x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2039AYMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--power-switches/mic2039aymt-tr-microchip-8067925
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2039AYMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--power-switches/mic2039aymt-tr-microchip-8067925
Microchip MIC2039AYMT-TR - Caractéristiques techniques
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 125mΩ |
| Type: | Current Limit Switch |
| Operating Temp Range: | -40°C to +125°C |
| Turn-off Delay Time: | 5µs |
| Turn-on Delay Time: | 700µs |
| Current - Limit: | 2.5A |
| Rise Time: | 700µs |
| Fall Time: | 32µs |
| Style d'emballage : | UDFN-6 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
UDFN-6
Méthode de montage :
Surface Mount