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Référence fabricant
SST39VF802C-70-4C-B3KE
SST39VF Series 8 M ( 512K x 16) 3.6 V Multi-Purpose Flash Plus SMT - TFBGA-48
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :480 par Tray Style d'emballage :TFBGA-48 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SST39VF802C-70-4C-B3KE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***July 26, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 23, 2024***Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF802C-70-4C-B3KE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--nor/sst39vf802c-70-4c-b3ke-microchip-2014633
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF802C-70-4C-B3KE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--nor/sst39vf802c-70-4c-b3ke-microchip-2014633
Microchip SST39VF802C-70-4C-B3KE - Caractéristiques techniques
| Memory Density: | 8Mb |
| Memory Organization: | 512 K x 16 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Style d'emballage : | TFBGA-48 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Features:
- Single Voltage Read and Write Operations– 2.7 - 3.6 V
- Superior Reliability
- Endurance: 100,000 Cycles (Typical)
- Greater than 100 years Data Retention
- Low Power Consumption (typical values at 5 MHz)
- Active Current: 5 mA (typical)
- Standby Current: 3 μA (typical)
- Auto Low Power Mode: 3 μA (typical)
- Hardware Block-Protection/WP# Input Pin
- Top Block-Protection (top 8 KWord)
- Bottom Block-Protection (bottom 8 KWord)
- Sector-Erase Capability
- Uniform 2 KWord sectors
- Block-Erase Capability
- Flexible block architecture; one 8-, two 4-, one 16-, and fifteen 32-KWord blocks
- Chip-Erase Capability
- Erase-Suspend/Erase-Resume Capabilities
- Hardware Reset Pin (RST#)
- Latched Address and Data
- Security-ID Feature
- SST: 128 bits; User: 128 words
- Fast Read Access Time: 70 ns
- Fast Erase and Word-Program:
- Sector-Erase Time: 18 ms (typical)
- Block-Erase Time: 18 ms (typical)
- Chip-Erase Time: 40 ms (typical)
- Word-Program Time: 7 μs (typical)
- Automatic Write Timing
- Internal VPP Generation
- End-of-Write Detection
- Toggle Bits
- Data# Polling
- Ready/Busy# Pin
- CMOS I/O Compatibility
- JEDEC Standard
- Flash EEPROM Pinouts and command sets
- All devices are RoHS compliant
Emballages disponibles
Qté d'emballage(s) :
480 par Tray
Style d'emballage :
TFBGA-48
Méthode de montage :
Surface Mount