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Référence fabricant
MX66L2G45GXRI00
IC FLASH SERIAL NOR 2GBIT
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| Nom du fabricant: | Macronix | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :480 par Tray Style d'emballage :BGA-24 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Macronix MX66L2G45GXRI00 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Change Descritption:Please be informed that Macronix?s assembly subcontractor?SPIL is ongoing to continue the assemblyfor Macronix TSOP and CSPpackage products for one year and take the last order on Aug. 30th, 2026,then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement --ChipMOS, OSE, ASECLand LINGSEN.For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026(last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027(last ship date).
Cancellation of Future PCN 115598 isued as Discontinuation. Change Descritption:Please be informed that Macronix?s assembly subcontractor?SPIL is ongoing to continue the assemblyfor Macronix TSOP and CSPpackage products for one year and take the last order on Aug. 30th, 2026,then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement --ChipMOS, OSE, ASECLand LINGSEN.For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026(last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipmentdatedesignated by the customer before Aug. 30th, 2027(last ship date).
Description:Please be informed that Macronix?s assembly subcontractor ? SPIL is ongoing to continue the assembly for Macronix TSOP and CSP package products for one year and take the last order on Aug. 30th, 2026, then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement -- ChipMOS, OSE, ASECL and LINGSEN. For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026 (last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027 (last ship date)Reason of Change:Due to capacity allocation, SPIL decided to EOL all Au wire assembly line, which includes Macronix? TSOP and CSP package production at SPIL.Last order date for SPIL TSOP and CSP package products: 2026/8/30Last shipping date for SPIL TSOP and CSP package products: 2027/8/30
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MX66L2G45GXRI00&field4=Macronix&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--serial/mx66l2g45gxri00-macronix-3094874
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MX66L2G45GXRI00&field4=Macronix&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--serial/mx66l2g45gxri00-macronix-3094874
Macronix MX66L2G45GXRI00 - Caractéristiques techniques
| Program Memory Type: | Flash |
| Clock Frequency-Max: | 166MHz |
| InterfaceType / Connectivity: | SPI |
| Memory Density: | 2Gb |
| Memory Organization: | 256 M x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Input Capacitance: | 32pF |
| NOR Serial Type: | Multi I/O, Quad |
| Style d'emballage : | BGA-24 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
480 par Tray
Style d'emballage :
BGA-24
Méthode de montage :
Surface Mount