Référence fabricant
ATSAMA5D27C-LD2G-CU
CORTEX-A5 MPU,2GBIT LPDDR2,BGA,IND TEMP
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :84 par Tray Style d'emballage :TFBGA-361 Méthode de montage :Surface Mount |
||||||||||
| Code de date: | 2521 | ||||||||||
Microchip ATSAMA5D27C-LD2G-CU - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Microchip has released a new Datasheet for the SAMA5D2 System-in-Package (SiP) Data Sheet of devices.Introduced Software License Level 3 (SL3) content.Configuration Summary: updated SAMA5D225 UART/SPI/I2C information.Reason for change: To improve productivityDate Document Changes Effective: 01 December 2025
Description of Change:Microchip has released a new Document for the SAMA5D2 System-in-Package (SiP) Silicon Errata and Data Sheet Clarifications of devices. Updated Scope with Software License Level 3 (SL3) contentReason for Change: To improve productivityDate Document Changes Effective: 17 Nov 2025
Microchip has released a new Errata for the SAMA5D2 SIP Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Updated 1. Silicon Issue Summary Added in 6. Controller Area Network (MCAN): - 6.13. Frame transmitted despite confirmed transmit cancellation for CAN-FD messages with more than 8 data bytes Added in 13. Secure Digital MultiMedia Card Controller (SDMMC): - 13.3. SDMMC I/O calibration does not workImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 06 Sep 2022
Statut du produit:
Microchip ATSAMA5D27C-LD2G-CU - Caractéristiques techniques
| Family Name: | SAMA5D2 |
| Core Processor: | ARM Cortex A5 |
| Speed: | 500MHz |
| No of I/O Lines: | 128 |
| InterfaceType / Connectivity: | CAN/I2C/QSPI/SPI/UART |
| Number Of Timers: | 6 |
| Supply Voltage: | 1.8V |
| Operating Temperature: | -40°C to +85°C |
| Style d'emballage : | TFBGA-361 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
84 par Tray
Style d'emballage :
TFBGA-361
Méthode de montage :
Surface Mount