
Manufacturer Part #
ATXMEGA32D4-AU
XMEGA Series 32 kB Flash 4 KB SRAM 32 MHz 8/16-Bit Microcontroller - TQFP-44
Microchip ATXMEGA32D4-AU - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 22 July 2025 (date code: 2530)
Part Status:
Microchip ATXMEGA32D4-AU - Technical Attributes
Family Name: | XMEGA |
Core Processor: | AVR |
Program Memory Type: | Flash |
Flash Size (Bytes): | 32kB |
RAM Size: | 4kB |
Speed: | 32MHz |
No of I/O Lines: | 34 |
InterfaceType / Connectivity: | IrDA/I2C/SPI/UART/USART |
Number Of Timers: | 4 |
Supply Voltage: | 1.6V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 12-chx12-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-44 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-44
Mounting Method:
Surface Mount