Manufacturer Part #
MCP1541T-I/TT
MCP1541 Series 4.3 to 5.5 V Supply SMT 4.096 V Voltage Reference SOT-23-3
Microchip MCP1541T-I/TT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
***UPDATE OF PCN113742***Revision History: June 12, 2025: Issued initial notification.August 04, 2025: Issued final notification. Attached qualification report. Provided estimated first ship date to be on August 21, 2025. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP9700B, MCP130, MCP9700, MCP9700A, TC1047A, TC1047, MCP102, MCP9701, MCP9701A, TCM808, MCP1525, MCP1541 device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 21 August 2025 (date code: 2534)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP9700B, MCP130, MCP9700, MCP9700A, TC1047A, TC1047, MCP102, MCP9701, MCP9701A, TCM808, MCP1525, MCP1541 device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: July 2025
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip MCP1541T-I/TT - Technical Attributes
| Type: | Series | 
| Reference Voltage: | 4.096V | 
| Tolerance (%): | ±1% | 
| Rated Current: | 20mA | 
| Rated Voltage: | 4.3V to 5.5V | 
| Forward (Drive) Current: | 8mA | 
| Quiescent Current: | 100µA | 
| Package Style: | SOT-23 (SC-59,TO-236) | 
| Mounting Method: | Surface Mount | 
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount