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Référence fabricant
PIC18F47Q10-I/PT
PIC18F Series 128 kB Flash 3.53 kB RAM 64 MHz 8-Bit Microcontroller - TQFP-44
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :160 par Tray Style d'emballage :TQFP-44 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC18F47Q10-I/PT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F1537x, PIC16F1887x, PIC16F1917x, PIC16F1919x, PIC18F44Q71, PIC18F45K4x, PIC18F45Qxx, PIC18F46K4x, PIC18F46Qxx, PIC18F47K4x, PIC18F47Qxx, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in 44L and 64L TQFP (10x10x1mm) packages.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material.Estimated First Ship Date: 30 May 2025 (date code: 2522)
Microchip has released a new Document for the PIC18F27/47Q10 Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change: Removed Data Sheet Clarifications and updated Data Sheet Revision. Minor editorial corrections.Impacts to Data Sheet: NoneReason for Change: To improve productivity. Change Implementation Status: CompleteDate Document Changes Effective: 23 May 2024
Microchip has released a new Datasheet for the PIC18F27/47Q10 28/40/44-pin, Low-Power, High-Performance Microcontrollers Data Sheet of devices. Notification Status: FinalDescription of Change: Updated reset values for IPR0, IPR3, IPR5, IPR6, OSCON3, TMR0H, and BAUDxCON.Impacts to Data Sheet: See above details.Reason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 23 May 2024
Microchip has released a new Errata for the PIC18F27/47Q10 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: Added silicon erratum item 1.9.1Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 Nov 2022
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC18F47Q10-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/8113190
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC18F47Q10-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/8113190
Microchip PIC18F47Q10-I/PT - Caractéristiques techniques
| Family Name: | PIC XLP 18Q |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 3.53kB |
| Speed: | 64MHz |
| No of I/O Lines: | 36 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/HLVD/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 35-chx10-bit |
| On-Chip DAC: | 1-chx5-bit |
| Style d'emballage : | TQFP-44 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
160 par Tray
Style d'emballage :
TQFP-44
Méthode de montage :
Surface Mount