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MCP19035-AAAAE/MF
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120 per Tube
DFN-10
Surface Mount
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PCN Information:
***UPDATE OF PCN111555, PCN120669***Revision History: March 19, 2025: Issued initial notification.April 17, 2026: Issued final notification. Provided the estimated first ship date to be on April 24, 2026. Updated the Notification Subject and Description of Change to add missing device families and also updated the Qualification Plan title and purpose.April 22, 2026: Re-issued final notification to remove the word Qualification Report in the revision history.Product Category: Hybrid Controllers, Power Management - PWM Controllers, Switching RegulatorsDescription of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP1664, MCP19035, MCP19110, MCP19111, MCP19114, MCP19115, MCP19116, MCP19117, MCP19118, MCP19119, MCP19122, MCP19123, MCP19124, MCP19125, MCP19214 and MCP19215 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 24 April 2026 (date code: 2617)
*** Update of FPCN 111555 / Multiple Change Notification ***Revision History: March 19, 2025: Issued initial notification.April 17, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on April 24, 2026. Updated the Notification Subject and Description of Change to add missing device families and also updated the Qualification Plan title and purpose.Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP1664, MCP19035, MCP19110, MCP19111, MCP19114, MCP19115, MCP19116, MCP19117, MCP19118, MCP19119, MCP19122, MCP19123, MCP19124, MCP19125, MCP19214 and MCP19215 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 05 June 2026Estimated First Ship Date: 24 April 2026 (date code: 2617)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP19110, MCP19116,MCP19117, MCP19122, MCP19123, MCP19124 and MCP19214 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP19035 - High-Speed Synchronous Buck Controller of devices. Notification Status: FinalDescription of Change: Revision C (December 2022) ? Update document layout. ? Added automotive qualification to Features, General Description and examples to Product Identification System.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 15 Dec 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
The MCP19035-AAAAE/MF is a optimized, highspeed synchronous buck controller. Operates from input voltage sources up to 30 V. This controller implements a voltage-mode control architecture with a fixed switching frequency of 300 kHz.
The high switching frequency facilitates uses smaller passive components, including the inductor and input/output capacitors, allowing a compact, high performance power supply solution. It implements an adaptive anti-cross conduction scheme to prevent shoot-through in the external power MOSFET.
Features:
Applications:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.