
Référence fabricant
MCP19035-AAAAE/MF
MCP19035 Series 300 kHz 20 ns Synchronous Buck PWM Controller - DFN-10
Microchip MCP19035-AAAAE/MF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP19110, MCP19116,MCP19117, MCP19122, MCP19123, MCP19124 and MCP19214 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP19035 - High-Speed Synchronous Buck Controller of devices. Notification Status: FinalDescription of Change: Revision C (December 2022) ? Update document layout. ? Added automotive qualification to Features, General Description and examples to Product Identification System.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 15 Dec 2022
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
Microchip MCP19035-AAAAE/MF - Caractéristiques techniques
Supply Voltage: | 4.5V to 30V |
Frequency-Max: | 300kHz |
Duty Cycle-Max: | 85% |
Operating Temp Range: | -40°C to +125°C |
Style d'emballage : | DFN-10 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
120 par Tube
Style d'emballage :
DFN-10
Méthode de montage :
Surface Mount