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Manufacturer Part #
AT32UC3A1128-AUT
Microchip AT32UC3A1128-AUT - Product Specification
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Description of Change:Qualification of palladium-coated copper with gold flash (CuPdAu) as a new wire material for ATSAM4LS2CA, ATSAM4LC8CA, ATSAM4LS8CA, AT32UC3A1512, AT32UC3A1128, AT32UC3A1256, ATSAM4LC4CA, ATSAM4LS4CA, ATSAM4LC2CA, AT32UC3C1128C, AT32UC3C1256C, AT32UC3C1512C and AT32UC3C164C device families available in 100L TQFP (14x14x1mm) package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Revision History:September 7, 2023: Issued initial notification.October 18, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP(14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Microchip has released a new Product Documents for the AT32UC3A Family Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: This is the initial released version of this document, which is specific to Revision M silicon.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Nov 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
90 per Std. Mfr. Pkg