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Manufacturer Part #
LE9643AQCT
Telecom Interface ICs 1CH 100V miSLIC, 36QFN
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:3000 per Reel |
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| Date Code: | 2541 | ||||||||||
Microchip LE9643AQCT - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 110874 ***Description of Change: Qualification of NSEB (UTL-2) as a new final test site and scan and pack site for selected LE79271, LE9541, LE9621, LE9641, LE9642, LE9643, LE9651, LE9652, LE9653 and ZL88107 device families available in various packages.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying NSEB (UTL-2) as a new final test site and scan and pack site.Estimated First Ship Date: 23 May 2025 (date code: 2521)Revision History: February 13, 2025: Issued initial notification.May 09, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on May 23, 2025.
Description of Change:Qualification of NSEB (UTL-2) as a new final test site and scan and pack site for selected LE79271, LE9541, LE9621, LE9641, LE9642, LE9643, LE9651, LE9652, LE9653 and ZL88107 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying NSEB (UTL-2) as a new final test site and scan and pack site.
Revision History:May 24, 2022: Issued initial notification.May 05, 2023: Issued final notification. Attached the Qualification Report. Updated the affected CPN list.Provided estimated first ship date to be on May 06, 2023.Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9643AQC, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size
Revision History:May 24, 2022: Issued initial notification.May 05, 2023: Issued final notification. Attached the Qualification Report. Updated the affected CPN list.Provided estimated first ship date to be on May 06, 2023.Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9643AQC, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at ASEM assembly site.Reason for Change:To improve productivity by qualifying a new die size.
Revision History:May 24, 2022: Issued initial notification.April 20, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on May 5, 2023.PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MMT assembly site.Pre and Post Change Summary: See attached for more detailsReason for Change:To improve productivity by qualifying a new die size.Change Implementation Status:In ProgressEstimated First Ship Date:May 5, 2023 (date code: 2318)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached for more details
Description of Change:Qualification of a new die size (1.932x1.860mm) for Die #1 of selected Microsemi LE9653AQC, LE9653AQCT, LE9621AQC, LE9643AQC, LE9621AQCT, and LE9643AQCT catalog part numbers (CPN) available in 36L VQFN (4x6x1mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying a new die size
Part Status:
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Available Packaging
Package Qty:
3000 per Reel