Référence fabricant
MIC2569YQS
MIC2569 Series 1 Channel 5.5V 220uA Surface Mount CableCARD Power Switch QSOP-16
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :98 par Tube Style d'emballage :QSOP-16 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2569YQS - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Statut du produit:
Microchip MIC2569YQS - Caractéristiques techniques
| Input Voltage: | 3V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 110mΩ |
| Rated Current-Max: | 220µA |
| Type: | Power Switch |
| Style d'emballage : | QSOP-16 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
MIC2569YQS is designed to supply power from within the CableCARD™ host to the CableCARD™. Prior to release 2.0 of the CableCARD™ Interface Specification these cards were also known as Point of Distribution (POD) cards.
MIC2569 supports both Single and Multiple stream cards through a simple to control parallel interface. All voltage switching is soft-start at turn-on, and break-before-make when changing between different voltage supplies. Built in current limiting protects all VCC and VPP output lines of the host system from card faults and accidental short circuits. MIC2569 provides a FAULT/ signal to indicate an over-current or fault condition exists and is equipped with internal thermal monitoring circuitry to protect the device itself in the event of a sustained over-current condition. MIC2569 is offered in a space saving 16 pin QSOP packaging.
Key Features:
- 110 m? maximum VCC on resistance.
- 400 m? maximum VPP on resistance.
- 3.0 V to 3.6 V for the 3.3VIN operating range.
- 3.0 V to 5.5 V for the operating range.
- 1.3 A minimum VCC current limit.
- 150 mA minimum VPP current limit (150 mA each).
- Compact 16-pin QSOP packaging.
- Operating temperatures from –40°C to +85°C.
- Low quiescent current.
- Soft start turn-on.
- Break-before-make voltage switching.
- Short-circuit protection with thermal shutdown.
- Input under voltage lock-out (UVLO).
- ESD protection.
- No external components required.
To learn more about the MIC2569 product family, Click Here.
Emballages disponibles
Qté d'emballage(s) :
98 par Tube
Style d'emballage :
QSOP-16
Méthode de montage :
Surface Mount