Référence fabricant
BAV99UE6327HTSA1
AF Discretes
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SC-74 (TSOP-6) Méthode de montage :Surface Mount | ||||||||||
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Infineon BAV99UE6327HTSA1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change informationSubject: Introduction of additional plating production at Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China for several productsReason/Motivation:Expansion of plating production to assure continuity of supply and enable flexible manufacturing by recovery of Welnew Wuxi Plating site for DS products (PCN 2023-034-A) DescriptionOldShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaNewShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaWuxi Welnew Microelectronic Co., Ltd., Wuxi, ChinaIntended start of delivery: 2026-06-20Last order date (LOD): 2026-06-20Last delivery date (LDD): 2026-12-20
Statut du produit:
Infineon BAV99UE6327HTSA1 - Caractéristiques techniques
| Type: | Silicon |
| Configuration: | Dual |
| Reverse Current-Max: | 50µA |
| Forward Voltage: | 1.25V |
| Reverse Voltage-Max [Vrrm]: | 80V |
| Reverse Recovery Time-Max: | 4ns |
| Power Dissipation: | 250mW |
| Average Forward Current-Max: | 200mA |
| Operating Temp Range: | -65°C to +150°C |
| Style d'emballage : | SC-74 (TSOP-6) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SC-74 (TSOP-6)
Méthode de montage :
Surface Mount