Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
DSEI2X30-10B
DSEI Series 1000 Vrrm 2 X 30 A 2.4 Vf Fast Recovery Epitaxial Diode - SOT-227B
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | Littelfuse - IXYS | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :10 par Tube Style d'emballage :SOT-227B Méthode de montage :Surface Mount |
||||||||||
| Code de date: | |||||||||||
Littelfuse - IXYS DSEI2X30-10B - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
Littelfuse would like to notify you that we have qualified alternative Epoxy Molding Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).Package types includes : TO-262, TO-3P, TO-247, SOT227, TO-268, TO-263, TO-220.All affected IXYS Brand Thyristor & Diode Discrete products have been fully qualified in accordance with established performance and reliability criteria using alternative EMC. The attached pages summarized the qualification results. Full qualification data and/or samples will be available upon request.Form, fit, function changes: No Fit/Form/Function change with alternative EMC.Effective date: August 10th, 2024
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor & Diode products SOT-227 Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: Some part numbers change from Pad type to Padless type. Refer to PCN report. 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Statut du produit:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSEI2X30-10B&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--diodes--ultrafast-rectifiers/dsei2x30-10b-littelfuse-ixys-2522191
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSEI2X30-10B&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--diodes--ultrafast-rectifiers/dsei2x30-10b-littelfuse-ixys-2522191
Littelfuse - IXYS DSEI2X30-10B - Caractéristiques techniques
| Average Rectified Current-Max: | 30A |
| Reverse Voltage-Max [Vrrm]: | 1000V |
| Reverse Current-Max: | 750µA |
| Forward Voltage: | 2.4V |
| Reverse Recovery Time-Max: | 50ns |
| Style d'emballage : | SOT-227B |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
10 par Tube
Style d'emballage :
SOT-227B
Méthode de montage :
Surface Mount