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Manufacturer Part #
S29GL128P90FFIR20
S29GL128P Series 128 Mb (16M x 8) 3 V 90 ns Flash-NOR Memory - BGA-64
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:180 per Tray Package Style:BGA-64 Mounting Method:Surface Mount | ||||||||||
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Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes.
Qualification of Copper Palladium Gold Wire (CuPdAu) and Shinetsu KMC3580LVA Mold Compound for FBGA Packages Assembled at Cypress Bangkok Description of Change: Cypress announces the qualification of Copper Palladium Gold (CuPdAu) wire and Shinetsu KMC3580LVA mold compound for FBGA packages assembled at Cypress Bangkok. This new bond wire type is consistent with industry standards per AEC-Q006 requirements. This mold compound is consistent with Cypress' drive to Green and Pb-free RoHS compliant packages. In addition, this Green and Pb-free (Shinetsu KMC3580LVA) mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness and lead finish.
Part Status:
Technical Attributes
| Memory Density: | 128Mb |
| Supply Voltage-Nom: | 3V to 3.6V |
| Access Time-Max: | 90ns |
| Package Style: | BGA-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
180 per Tray
Package Style:
BGA-64
Mounting Method:
Surface Mount