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Référence fabricant
DSPIC33FJ64GS606T-I/PT
dsPIC33F Series 9 KB RAM 64 kB Flash 16-Bit Digital Signal Controller - TQFP-64
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1200 par Reel Style d'emballage :TQFP-64 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip DSPIC33FJ64GS606T-I/PT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSPIC33FJ64GS606T-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33fj64gs606t-i-pt-microchip-1022637
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSPIC33FJ64GS606T-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33fj64gs606t-i-pt-microchip-1022637
Microchip DSPIC33FJ64GS606T-I/PT - Caractéristiques techniques
| Family Name: | dsPIC33F |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 9kB |
| Speed: | 40MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | CAN/I2C/SPI/UART |
| Peripherals: | Analog Comparators/CAN/I2C/On-Chip-ADC/On-Chip-DAC/PWM/SPI/UART/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| On-Chip DAC: | 4-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-64 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The DSPIC33FJ64GS606T-I/PT is a 16-Bit Digital Signal Controller with High-Speed PWM, ADC and Comparators. Available in surface mount TQFP-64 package.
Features:
- Core: 16-Bit dsPIC33F
- Code-Efficient (C and Assembly) Architecture
- Two 40-Bit Wide Accumulators
- Single-Cycle (MAC/MPY) with Dual Data Fetch
- Single-Cycle Mixed-Sign MUL plus Hardware Divide
- 32-Bit Multiply Support
- Clock Management
- ±1% Internal Oscillator
- Programmable PLLs and Oscillator Clock Sources
- Fast Wake-up and Start-up
- Power Management
- Low-Power Management modes (Sleep, Idle, Doze)
- Integrated Power-on Reset and Brown-out Reset
- High-Speed PWM
- Up to 9 PWM Pairs with Independent Timing
- Dead Time for Rising and Falling Edges
- 1.04 ns PWM Resolution
- Advanced Analog Features
- High-Speed ADC module: 10-bit resolution with up to two Successive Approximation Register (SAR)
- Timers/Output Compare/Input Capture
- Six General Purpose Timers
- Four Output Compare (OC) modules Configurable as Timers/Counters
- Communication Interfaces
- Two UART modules (12.5 Mbps)
- Two 4-wire SPI modules (15 Mbps)
- ECAN™ module (1 Mbaud) CAN 2.0B Support
- Two I2C™ modules (up to 1 Mbaud) with SMBus Support
- Direct Memory Access (DMA)
- 4-Channel DMA with User-Selectable Priority Arbitration
- UART, SPI, ECAN™, IC, OC and Timers
Applications:
- AC to DC Converters
- DC to DC Converters
- Power Factor Correction (PFC)
- Uninterruptible power supply (UPS)
- Inverters
- Embedded Power-Supply Controllers
- Circuit Breakers
- Arc Fault Detection
Emballages disponibles
Qté d'emballage(s) :
1200 par Reel
Style d'emballage :
TQFP-64
Méthode de montage :
Surface Mount
