
Manufacturer Part #
PIC32CM5164LE00100-I/PF
PIC32CM Series 512 kB Flash 64 kB SRAM SMT 32-Bit Microcontroller - TQFP-48
Microchip PIC32CM5164LE00100-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Microchip has released a new Datasheet for the PIC32CM LE00/LS00/LS60 Family Data Sheet of devices. Notification Status: FinalDescription of Change:Ordering Information: Updated Content to reflect the addition of Extended Temperature partsExtended Temperature Electrical Characteristics (125°C): New sectionImpacts to Data Sheet: See above details.Reason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 03 Jan 2025
Cancellation Notice: For the qualification of UMC Fab 8S (U08S) an additional fabrication site for selected PIC32CM5164xx and PIC32CM2532xx device families available in various packages.Reason for Change: Microchip has decided to not qualify UMC Fab 8S (U08S) an additional fabrication site for selected PIC32CM5164xx and PIC32CM2532xx device families available in various packages.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Document for the PIC32CM LE00/LS00/LS60 Family Silicon Errata and Data Sheet Clarifications of devices. Description of Change:Updated Silicon Revision C0 in PIC32CM LE00/LS00/LS60 Family Errata to remove erroneous Silicon Revision ID designations.Impacts to Data Sheet: NoneChange Implementation Status: CompleteEstimated First Ship Date: 31 May 2024
Revision History:September 28, 2022: Updated the Description of Change to include Silicon Revision B0.Microchip has released a new Errata for the PIC32CM LE00/LS00/LS60 Family Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Updated the Silicon Revision throughout the document to B0Added the following new errata: ? EVSYS: 2.6.3 Synchronous/Resynchronized Modes ? TCC: 2.16.6 DMA One-Shot Trigger Mode UpdatedTable 3. PIC32CM LS60 Family Silicon Device Identification
Part Status:
Microchip PIC32CM5164LE00100-I/PF - Technical Attributes
Family Name: | PIC32CM |
Core Processor: | ARM Cortex M23 |
Program Memory Type: | Flash |
Flash Size (Bytes): | 512kB |
RAM Size: | 64kB |
Speed: | 48MHz |
No of I/O Lines: | 80 |
InterfaceType / Connectivity: | I2C/I2S/SPI/USART/USB |
Peripherals: | Brown-out Detect/DMA/POR/PWM/Watchdog |
Number Of Timers: | 8 |
Supply Voltage: | 1.62V to 3.63V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 24-chx12-bit |
On-Chip DAC: | 2-chx12-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-100 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount