
Référence fabricant
R5F56218BDFP#V0
RX621 Series 512 kB Flash 96 kB RAM SMT 32-Bit Microcontroller -LQFP-100
Renesas R5F56218BDFP#V0 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.Reason for Change: To secure a stable product supply and environment friendly strengthening (Improvement of efficiency in use of packaging resources, reduction of waste)
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
Subject: MCU/SOC products announcement of Full Carton.Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
Statut du produit:
Renesas R5F56218BDFP#V0 - Caractéristiques techniques
Family Name: | RX600 |
Core Processor: | RX |
Program Memory Type: | Flash |
Flash Size (Bytes): | 512kB |
RAM Size: | 96kB |
Speed: | 100MHz |
No of I/O Lines: | 72 |
InterfaceType / Connectivity: | CAN/I2C/SPI/USB |
Peripherals: | CAN/I2C/On-Chip-ADC/On-Chip-DAC/SPI/USB/Watchdog |
Number Of Timers: | 20 |
Supply Voltage: | 2.7V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 8-chx10-bit / 8-chx12-bit |
On-Chip DAC: | 1-chx10-bit |
Watchdog Timers: | 1 |
Style d'emballage : | LQFP-100 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
1 par Tray
Style d'emballage :
LQFP-100
Méthode de montage :
Surface Mount