Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.
Fabrication Site Change
12/13/2019 Details and Download
Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date: June 2020
Moisture Sensitivity Change
08/05/2019 Details and Download
Description of Change:Implement new packing material (non-bakeable tray) for selected Atmel products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Pre Change:Use of bakeable tray packing material in MSL 3 requirementsPost Change:Use of non-bakeable tray packing material in MSL 1 requirementsReason for Change:To improve manufacturability and qualify new packing material (non-bakeable tray) in MSL 1 requirements.
Assembly Site Change
03/06/2019 Details and Download
Revision History:August 09, 2018: Issued initial notification.December 19, 2018: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 19, 2019.March 4, 2019: Re-issued final notification to update the subject and description because of the update in scope to include 64L TQFP package. Updated the affected CPN list in accordance with the update to the scope. Updated the pre and post change summary table MSL classification for MMT site from MSL 1 and 2 to MSL 3. Updated the pre and post change to add ANAP assembly site which is applicable for 64L TQFP package.Description of Change:Qualification of MMT as an additional assembly site for selected Atmel products of the 35.4K, 35.5K and 35.9K wafer technologies available in 64L TQFP (14x14x1.0mm) and 100L TQFP (14x14x1.0mm) packages.Pre Change:Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire, CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold compound and C194 lead frame material.Post Change:Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire, CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold compound and C194 lead frame material or assembled in MMT using Au wire, 3280 die attach, G700 mold compound and C194 lead frame material.Reason for Change:To Improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:For 100L TQFP package: January 19, 2019 (date code: 1903)For 64L TQFP package: March 30, 2019 (date code: 1913)
