
Référence fabricant
ATTINY3224-SSU
20MHz, 32KB, SOIC14, Ind 85C, Green, Tube
Microchip ATTINY3224-SSU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Microchip has released a new Document for the ATtiny3224/3226/3227 Silicon Errata and Data Sheet Clarifications of devices. Description of Change:• Document:– Editorial updates• Added new errata:– Device:• 2.2.1. IDD Power-Down Current Consumption• 2.2.2. Writing the OSCLOCK Fuse in FUSE.OSCCFG to ‘1’ Prevents Automatic Loading ofCalibration Values• 2.2.3. Write Operation Lost if Consecutive Writes to Specific Address Spaces– ADC: 2.3.3. ADC Stays Active in Sleep Modes for Low Latency Mode and Free Running Mode– CRCSCAN: 2.5.1. Running CRC Scan on Part of The Flash is Non-Functional– NVMCTRL: 2.6.1. Wrong Reset Value of NVMCTRL.CTRLA Register– TCA: 2.7.1. Restart Will Reset Counter Direction in NORMAL and FRQ Mode– USART: 2.9.2. Receiver Non-Functional after Detection of Inconsistent Synchronization Field• Added new data sheet clarifications:– I/O Multiplexing and Considerations:• 3.1.1. I/O Multiplexing– Electrical Characteristics:• 3.2.1. I/O Pin Characteristics• 3.2.2. SPI - Timing Characteristics• 3.2.3. Programming TimeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 04 June 2024
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Statut du produit:
Microchip ATTINY3224-SSU - Caractéristiques techniques
Family Name: | tinyAVR 2 |
Core Processor: | AVR |
Program Memory Type: | Flash |
Flash Size (Bytes): | 32kB |
RAM Size: | 3kB |
Speed: | 20MHz |
No of I/O Lines: | 12 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | Brown-out Detect/POR/PWM |
Number Of Timers: | 3 |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 9-chx12-bit |
Watchdog Timers: | 1 |
Style d'emballage : | SOIC-14 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount