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Manufacturer Part #
BGS14PN10E6327XTSA1
SP4T High Linearity High Power RF Switch in a PG TSNP-10
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:7500 per Mounting Method:Surface Mount |
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| Date Code: | 2035 | ||||||||||
Infineon BGS14PN10E6327XTSA1 - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Detailed change information:Subject:Current wafer bumping location at Amkor Advanced Technology Taiwan Inc. will be discontinued. Qualified wafer bumping location at Amkor Assembly & Test (Shanghai) Co., Ltd. will be introduced.Reason: Infineon?s partner, Amkor Taiwan, announced discontinuation of 200mm wafer bumping plant by end of 2025.The wafer bumping of the affected products will be transferred to Amkor China, to assure continuity of supply.
Part Status:
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Infineon BGS14PN10E6327XTSA1 - Technical Attributes
| Operating Frequency-Max: | 6GHz |
| Operating Frequency-Min: | 0.5GHz |
| RF Switch Type: | SP4T |
| Insertion Loss-Max: | 2.35dB |
| Input Power: | 40dBm |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
7500 per
Mounting Method:
Surface Mount