Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
APT30D20BG
APT30D20B Series 200 V 30 A Ultrafast Soft Recovery Rectifier Diode - TO-247 [B]
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :30 par Tube Style d'emballage :TO-247-2 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip APT30D20BG - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of MCSO as an additional fabrication site for selected FRED 600V, FRED-400V, FRED-300V, FRED-200V, FRED-1200V and FRED-1000V device families available in various packages.Reason for Change: To improve productivity by qualifying MCSO as an additional fabrication site.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT30D20BG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/7102493
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT30D20BG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/7102493
Microchip APT30D20BG - Caractéristiques techniques
| Average Rectified Current-Max: | 30A |
| Peak Current-Max: | 320A |
| Reverse Voltage-Max [Vrrm]: | 200V |
| Reverse Current-Max: | 250µA |
| Forward Voltage: | 1.1V |
| Configuration: | Single |
| Forward RMS Current [If rms]: | 80A |
| Diode Capacitance-Max: | 95pF |
| Reverse Recovery Time-Max: | 24ns |
| Thermal Resistance: | 40°C/W |
| Operating Temp Range: | -55°C to +175°C |
| Storage Temperature Range: | -55°C to +175°C |
| Style d'emballage : | TO-247-2 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
TO-247-2
Méthode de montage :
Through Hole