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DSC1001DI1-033.3300
DSC1001 Series 3.3 V 33.33 MHz Low-Power Precision CMOS Oscillator - SMD-4
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :140 par Tube Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip DSC1001DI1-033.3300 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the DSC1001/3/4 - 1.8V-3.3V Low-Power Precision CMOS Oscillators of devices. Notification Status: FinalDescription of Change:• Added DSA10xx reference to Features and the Product Identification System sections for customers seeking AEC-Q100 qualified parts.• Updated all Package Outline Drawings with the most current versions.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 Jun 2025
Description of Change:Qualification of NSEB (UTL-2) as a new final test location for multiple device families available in various packages.Reason for Change:To improve manufacturability by qualifying NSEB (UTL-2) as a new final test location.Revision History:November 12, 2024: Issued initial notification.January 16, 2025: Issued final notification. Removed CPNs DSC612NI1A-0101 and DSC612NI1A-0101T due to being EOL'd. Updated the affected CPN list to add new additional parts from the scope. Attached the Qualification Report. Provided estimated first ship date to be on January 20, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of NSEB (UTL-2) as a new final test location for multiple device families available in various packages.Reason for Change:To improve manufacturability by qualifying NSEB (UTL-2) as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:November 2024
Microchip has released a new Datasheet for the DSC1001/3/4 - 1.8V-3.3V Low-Power Precision CMOS Oscillator of devices. Notification Status: FinalDescription of Change:• Updated the Package Marking Information drawing.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Jul 2023
Revision History:November 18, 2021: Issued initial notification.August 31, 2022: Issued final notification. Updated subject, description and affected CPN list to add DSC8 products as part of the scope and include catalog part numbers (CPN) released prior issuance of the Final PCN. Attached the Qualification Report. Provided estimated first ship date to be on September 1, 2022.September 09, 2022: Re-issued final notification. Changed the Assemby Site to Final Test Site in the pre and post change summary table.Description of Change:Qualification of STAR as an additional final test site for selected DSC100xxx and DSC8xxx device families available in 4L VDFN (3.2x2.5x0.9mm), (2.0x2.5mm) and (3.2x5.0x0.9mm) packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying STAR as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:September 1, 2022 (date code: 2236)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of STAR as an additional final test site for selected DSC100xxx and DSC8xxx device families available in 4L VDFN (3.2x2.5x0.9mm), (2.0x2.5mm) and (3.2x5.0x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying STAR as an additional final test site.Estimated First Ship Date:September 1, 2022 (date code: 2236)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSC1001DI1-033.3300&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/electromechanical--timing-devices--oscillators/dsc1001di1-033-3300-microchip-5052168
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DSC1001DI1-033.3300&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/electromechanical--timing-devices--oscillators/dsc1001di1-033-3300-microchip-5052168
Microchip DSC1001DI1-033.3300 - Caractéristiques techniques
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
140 par Tube
Méthode de montage :
Surface Mount